Intel’s 916,000-pound shipment is a “cold box,” a self-standing air-processor structure that facilitates the cryogenic technology needed to fabricate semiconductors. The box is 23 feet tall, 20 feet wide, and 280 feet long, nearly the length of a football field. The immense scale of the cold box necessitates a transit process that moves at a “parade pace” of 5-10 miles per hour. Intel is taking over southern Ohio’s roads for the next several weeks and months as it builds its new Ohio One Campus, a $28 billion project to create a 1,000-acre campus with two chip factories and room for more. Calling it the new “Silicon Heartland,” the project will be the first leading-edge semiconductor fab in the American Midwest, and once operational, will get to work on the “Angstrom era” of Intel processes, 20A and beyond.
I don’t know why, but I’ve never thought of the transport logistics involved in building a semiconductor fabrication plant.
I’m assuming the transport accommodations are part of the perk package (for lack of a better way to put it)
I have no insight into this particular plant, but in most big investments like this, the company is usually in talks with several locations negotiating for the best tax breaks, permitting accommodations, etc under the promise that it will bring skilled jobs to the area.
Basically, it’s seen as an investment both from the company and the location’s points-of-view.